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PCB production – knowledge base
The information on the following pages should support you in creating your PCB layouts.
01: Production process in PCB manufacturing
02: CAD data
03: Preparation of customer data and film production
04: Base materials and their properties
05: Current carrying capacity of printed tracks
06: Standard construction of multilayers
07: Flexible PCBs
08: Rigid-flex PCBs
09: Heatsink PCBs
10: Design guidelines for aluminium core circuits
11: AOI inspection
12: Solder resist varnish
13: Machining tolerances (milling, V-scoring and drill holes)
14: Suggested panel design for multipliers
15: Peelable masks
16: Blind and buried vias
17: Sealing of drill holes
18: Pattern layout – structure and width of tracks
19: Carbon paste printing
20: Unevenness (twist and warp)
21: PCB surfaces
22: Gold contacts on PCBs
23: Copper-thickness conversion table
24: Impedance on PCBs
25: CTI Comparative Tracking Index and PTI Proof Tracking Index of base material
26: Design rules for FR4 semi-flex PCBs
27: Test procedures in printed circuit board production
28: Connections for gold plugs (galvanic gold plug plating)
This area will be frequently expanded and adapted to the latest technology.
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