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22 – Gold contacts on PCBs
| Gold plating |
Process |
Au thickness |
H/S |
Ni thickness |
Applications |
| chemical |
chemical Ni/Au |
min. 0,05 μm |
soft |
3 – 5 μm |
SMT |
| galvanic |
partial
gold plating |
Plug gold |
0,76 – 1,2 μm |
hard |
3 – 5 μm |
Plug gold |
| Surface |
max. 1,2 μm |
hard |
3 – 5 μm |
partial gold plating |
Surface
metallization |
Entire surface |
0,08 – 0,1 μm |
hard |
3 – 5 μm |
Process after
copper metallization |
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